Si-to-Si fusion bonded touch mode capacitive pressure sensors

Mechatronics

Volumn 8, Issue 5, 1998, Pages 467-484

  Wang, Qiang ^a   Ko, Wen H ^a  

^a Case Western Reserve University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; DEFLECTION (STRUCTURES); DIAPHRAGMS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NONLINEAR PROGRAMMING; STRAIN; STRESS ANALYSIS; STRUCTURAL LOADS;

SILICON FUSION BONDING; SOFTWARE PACKAGE ABAQUS; TOUCH MODE CAPACITIVE PRESSURE SENSORS;

MICROSENSORS;

EID: 0032142597     PISSN: 09574158     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0957-4158(98)00013-0     Document Type: Article

References (12)

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