Orientation anomalies in plating thickness measurements from advanced packaging substrates

Semiconductor Science and Technology

Volumn 11, Issue 3, 1996, Pages 437-442

  Tan, N X ^a   Lee, A J Y ^b   Bourdillon, A J ^c   Tan, C Y S ^a  

^a Hewlett Packard (ICBD)   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BROMINE; COPPER; ELECTRONICS PACKAGING; FLUORESCENCE; GOLD; NICKEL; PLATING; SPURIOUS SIGNAL NOISE; SUBSTRATES; TUNGSTEN; X RAY SPECTROSCOPY;

ADVANCE PACKAGING SUBSTRATES; BOND FINGERS; NUMERICAL FILTER; ORIENTATION ANOMALIES; PLATING THICKNESS MEASUREMENT; PROPORTIONAL COUNTER DETECTOR; XRAY FLUORESCENCE SPECTROSCOPY;

THICKNESS MEASUREMENT;

EID: 0030107727     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/11/3/026     Document Type: Article

References (4)

1. Bertin EP 1975 The Principles and Practice of X-ray Spectrometric Analysis (New York: Plenum)
2. See, for example, Bourdillon, A J 1982 Proc. Microbeam Analysis Conf. (Washington) ed K F J Heinrich (San Francisco Press) pp 84-7
3. Liebhafsky H A, Pfeiffer H G, Winslow E H and Zemany P D 1972 X-rays, Electrons and Analytical Chemistry (New York: Wiley) pp 525-8
4. Gunn E L 1967 Handbook of X-rays ed E F Kaelble (New York: McGraw-Hill) ch 36