Analysis of coatings which inhibit epoxy bleeding in electronic packaging

Journal of Materials Science: Materials in Electronics

Volumn 8, Issue 2, 1997, Pages 73-77

  Tan, N X ^b   Lim, K H H ^b   Bourdillon, A J ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b Hewlett Packard (ICBD)   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CONTACT ANGLE; ELECTRONICS PACKAGING; EPOXY RESINS; HYDROCARBONS; IMPURITIES; INTERFACIAL ENERGY; WETTING;

CERAMIC PIN GRID ARRAY (CPGA); EPOXY BLEEDING; VACUUM BAKEOUT;

ORGANIC COATINGS;

EID: 0031120373     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018561106025     Document Type: Article

References (9)

1. J. E. IRELAND, Int. J. Hybrid Microelec. 5 (1982) 1.
2. N. X. TAN, A. J. Y. LEE, A. J. BOURDILLON and C. Y. S. TAN, Semicond. Sci. Technol. 17 (1996) 437.
3. C. A. MILLER and P. NEOGI, "Interfacial Phenomena: Equilibrium and Dynamic Effects" (Marcel Dekker, New York, 1980) pp. 54-83.
4. S. WU and K. J. BRZOZOWKSI, J. of Colloid Interface Sci. 37 (1971) 686.
5. V. A. PARSEGIAN, G. H. WEISS and M. E. SCHRADER, ibid. 61 (1977) 356.
6. W. R. TYSON and W. A. MILLER, Surf. Sci. 62 (1977) 267.
7. A. W. ADAMSON, "Physical Chemistry of Surfaces", 2nd Edn (Wiley, New York, 1967).
8. J. J. BIKERMAN, "Physical Surfaces" (Academic Press, London, 1970).
9. Test Methods and Procedures for Microelectronics, MIL-STD-883D, method 2019.5, USA (1993).