Measurement of wafer surface using shadow moiré technique with talbot effect

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 2, 1998, Pages 166-170

  Wei, S ^a   Wu, S ^a   Kao, I ^a   Chiang, F P ^a  

^a STONY BROOK UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTION GRATINGS; MOIRE FRINGES; SURFACE MEASUREMENT;

TALBOT EFFECT; TOTAL THICKNESS VARIATION (TTV);

SILICON WAFERS;

EID: 0032096922     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792612     Document Type: Article

References (15)

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