What drives defect detection technology?

MICRO

Volumn 16, Issue 6, 1998, Pages 51-74

  Weber, Charles ^a,d,e,f,g,h   Jensen, David ^b   Hirleman, E Dan ^c  

^a Hewlett Packard Sematech   (United States)

^b AMD/Sematech ^*

^c ARIZONA STATE UNIVERSITY   (United States)

^d SEMATECH   (United States)

^e IC Process R and D Center   (United States)

^f UNIVERSITY OF COLORADO   (United States)

^g UNIVERSITY OF CALIFORNIA   (United States)

^h MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATABASE SYSTEMS; DEFECTS; FAILURE ANALYSIS; INSPECTION; MATHEMATICAL MODELS; REAL TIME SYSTEMS; RESEARCH AND DEVELOPMENT MANAGEMENT; SCANNING ELECTRON MICROSCOPY; SENSORS; SHRINKAGE; X RAYS;

DEFECT DETECTION TECHNOLOGY; PATTERNED WAFER INSPECTION; PROCESS LIFE CYCLES; REAL TIME DEFECT CLASSIFICATION; SHRINKING FEATURE SIZES;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032095928     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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