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Volumn 10, Issue 6, 1998, Pages 875-877

High-speed optoelectronic hybrid-integrated transmitter module using a planar lightwave circuit (PLC) platform

Author keywords

High speed integrated circuits; Hybrid integrated circuits; Optical planar waveguides; Optical transmitters; Planar transmission lines; Semiconductor lasers

Indexed keywords

ABSORPTION; BANDWIDTH; BIT ERROR RATE; LIGHT TRANSMISSION; MICROPROCESSOR CHIPS; OPTICAL COMMUNICATION; OPTICAL WAVEGUIDES; SEMICONDUCTOR LASERS; SILICA; THERMAL CONDUCTIVITY; TRANSMITTERS;

EID: 0032095468     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/68.681515     Document Type: Article
Times cited : (9)

References (11)
  • 1
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  • 2
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    • (1995) J. Lightwave Technol. , vol.13 , pp. 2320-2326
    • Mino, S.1    Yoshino, K.2    Yamada, Y.3    Terui, T.4    Yasu, M.5    Moriwaki, K.6
  • 4
    • 0030283624 scopus 로고    scopus 로고
    • 10 Gb/s hybrid-integrated laser diode array module using a planar lightwave circuit (PLC)-platform
    • S. Mino, T. Ohyama, Y. Akahori, Y. Yamada, M. Yanagisawa, T. Hashimoto, and Y. Itaya, "10 Gb/s hybrid-integrated laser diode array module using a planar lightwave circuit (PLC)-platform," Electron. Lett., vol. 32, pp. 2232-2233, 1996.
    • (1996) Electron. Lett. , vol.32 , pp. 2232-2233
    • Mino, S.1    Ohyama, T.2    Akahori, Y.3    Yamada, Y.4    Yanagisawa, M.5    Hashimoto, T.6    Itaya, Y.7
  • 6
    • 0030675734 scopus 로고    scopus 로고
    • New flip chip bonding technique using transferred microsolder bumps
    • H. Tsunetsugu, T. Hayashi, M. Hosoya, and K. Katsura, "New flip chip bonding technique using transferred microsolder bumps," in Proc. IEMT/IMC Symp., 1997, pp. 56-61.
    • (1997) Proc. IEMT/IMC Symp. , pp. 56-61
    • Tsunetsugu, H.1    Hayashi, T.2    Hosoya, M.3    Katsura, K.4
  • 7
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    • Loss reduction in a coplanar waveguide on a planar lightwave circuit (PLC) platform by quenching
    • S. Mino, Y. Yamada, Y. Akahori, M. Yasu, and K. Moriwaki, "Loss reduction in a coplanar waveguide on a planar lightwave circuit (PLC) platform by quenching," J. Lightwave Technol., vol. 14, pp. 1840-1846, 1996.
    • (1996) J. Lightwave Technol. , vol.14 , pp. 1840-1846
    • Mino, S.1    Yamada, Y.2    Akahori, Y.3    Yasu, M.4    Moriwaki, K.5
  • 8
    • 0030287947 scopus 로고    scopus 로고
    • 10Gb/s hybrid-integrated receiver array module using a planar lightwave circuit (PLC) platform including a novel assembly region structure
    • S. Mino, T. Ohyama, Y. Akahori, T. Hashimoto, Y. Yamada, M. Yanagisawa, and Y. Muramoto, "10Gb/s hybrid-integrated receiver array module using a planar lightwave circuit (PLC) platform including a novel assembly region structure," J. Lightwave Technol., vol. 14, pp. 2475-2482, 1996.
    • (1996) J. Lightwave Technol. , vol.14 , pp. 2475-2482
    • Mino, S.1    Ohyama, T.2    Akahori, Y.3    Hashimoto, T.4    Yamada, Y.5    Yanagisawa, M.6    Muramoto, Y.7
  • 11
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    • 1.55 μm InGaAsP/InP laser buried in a high-resistivity epitaxial layer on a semi-insulating InP subatrate
    • Y. Sakai, Y. Itaya, S. Matsumoto, M. Fukuda, and M. Yamamoto, "1.55 μm InGaAsP/InP laser buried in a high-resistivity epitaxial layer on a semi-insulating InP subatrate," Electron. Lett., vol. 30, pp. 1481-1482, 1994.
    • (1994) Electron. Lett. , vol.30 , pp. 1481-1482
    • Sakai, Y.1    Itaya, Y.2    Matsumoto, S.3    Fukuda, M.4    Yamamoto, M.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.