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Volumn , Issue 448 /3, 1997, Pages 359-362
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Hybrid high-speed silica-based planar lightwave circuit platform integrating a laser diode and a driver IC
a a a a a a a a a
a
NTT CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC WIRING;
FLIP CHIP DEVICES;
SEMICONDUCTOR LASERS;
SILICA;
SOLDERING ALLOYS;
FLIP CHIP BONDING;
PLANAR LIGHTWAVE CIRCUITS (PLC);
INTEGRATED OPTOELECTRONICS;
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EID: 0031362404
PISSN: 05379989
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (13)
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References (7)
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