RTP technology for tomorrow

Solid State Technology

Volumn 41, Issue 6, 1998, Pages 171-X

  Thakur, R P S ^a   Timans, P J ^a   Tay, S P ^a  

^a AG Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTRIC FURNACES; SEMICONDUCTING FILMS; SEMICONDUCTOR JUNCTIONS; SILICON WAFERS; SURFACE CLEANING; THERMOANALYSIS; TRANSIENTS;

RAPID THERMAL PROCESSING (RTP);

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032083811     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (9)

1. R.P.S. Thakur et al., "Process Simplification in DRAM Manufacturing," IEEE Transactions on Electron Devices, Vol. 45, No. 3, p. 609, 1998.
2. R.P.S. Thakur, "Rapid Thermal Processing and ULSI Electronics," in Semi-conductor Fabtech, 5th ed., p. 261, 1996.
3. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, 1997.
4. S. Shishiguchi et al., "Boron-implanted Shallow Junction Formation by High-temperature/Short-time/High-ramping-rate (400°C/sec) RTA," Digest of Technical Papers, 1997 Symposium on VLSI Technology, pp. 89-90, 1997.
5. 2O Oxynitridation for Ultrathin Gate Dielectrics in 0.25-μm CMOS Processes and Beyond," Proceedings, 5th International Conference on Advanced Thermal Processing of Semiconductors (RTP '97), pp. 129-134, 1997.
6. A.C. Berti, V. Bolkhovsky, "A Manufacturable Process for the Formation of Self-aligned Cobalt Suicide in a Submicrometer CMOS Technology," Proc., 1992 VLSI Multilevel Interconnect Conference (VMIC), pp. 267-273, 1992.
7. Q.F. Wang et al., "Manufacturability Issues for Application of Silicides in 0.25-μm CMOS Processes and Beyond," Mat. Res. Soc. Symp. Proc., Vol. 402, pp 221-231, 1995.
8. P.J. Timans, "Temperature Measurement in Rapid Thermal Processing," Solid State Technology, Vol. 40, p. 63, 1997.
9. P.J. Timans, R.N. Morishige, Y. Wasserman, "Emissivity-independent Rapid Thermal Processing Using Radiation Shields," Mat. Res. Soc. Symp. Proc., Vol. 470, p. 57, 1997.