Low frequency noise analysis as a diagnostic tool to assess the quality of 0.25μm Ti-silicided poly lines

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 925-929

  Vandamme, E P ^b   De Wolf, I ^b   Lauwers, A ^b   Vandamme, L K J ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; MATHEMATICAL MODELS; QUALITY ASSURANCE; SPURIOUS SIGNAL NOISE; TITANIUM COMPOUNDS;

SILICIDED POLY LINES;

INTEGRATED CIRCUIT TESTING;

EID: 0032083656     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00114-0     Document Type: Article

References (7)

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3. Nicolet M and Lau S. VLSI Electronics Microstructure Science 6 (1983) p 415.
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5. Laker K and Sansen W. Design of analog integrated circuits and systems. McGraw-Hill, 1994.
6. Vandamme L. Noise as a diagnostic tool for quality and reliability of electronic devices. IEEE Trans. Electron Devices. TED-41 (1994) 2176-2187.
7. Vandamme L and van Kemenade A. Resistance noise measurement: a better diagnostic tool to detect stress and current induced degradation. Microelectron. Reliab. MR-37 (1997) 87-93.