Laser formed metallic connections

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 2, 1998, Pages 194-198

  Bernstein, Joseph B ^b   Zhang, Wei ^a,b   Nicholas, Carl H ^b  

^a IEEE   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Interconnect technologies; Interconnects; Laser processing; Laser restructuring; Laser induced; Laser programmable; Lateral link; MCM D; Memory defect; Memory redundancy; Memory repair; Metal connection; Metal link; Metallizations; Vertical link

Indexed keywords

ELECTRIC RESISTANCE; ELECTROMIGRATION; LASER APPLICATIONS; METALLIZING; MULTICHIP MODULES; WSI CIRCUITS;

INTERCONNECT TECHNOLOGIES; LASER RESTRUCTURING;

ELECTRONICS PACKAGING;

EID: 0032071581     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.673708     Document Type: Article

References (9)

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2. R. L. Rasera and J. B. Bernstein, "Laser linking of metal interconnect: Linking dynamics and failure analysis," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 19, pp. 554-561, Dec. 1996.
3. Y. L. Shen, S. Suresh, and J. B. Bernstein, "Laser linking of metal interconnect: Analysis and design considerations," IEEE Trans. Electron Devices, vol. 43, pp. 402-410, Mar. 1996.
4. J. B. Bernstein and B. D. Colella, "Laser-formed metallic connections employing a lateral link structure," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 18, pp. 690-692, Sept. 1995.
5. J. B. Bernstein, T. M. Ventura, and A. T. Radomski, "High density laser linking of metal interconnect," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 14, pp. 590-593, Dec. 1994.
6. J. Raffel, A. H. Anderson, and G. H. Chapman, ch. 7, Wafer Scale Integration. Norwell, MA: Kluwer, 1989, vol. 363.
7. U.S. Patent 4455495.
8. H. D. Hartmann and Th. Hillmann-Ruge, "Yield and reliability of laser-formed vertical links," from Proc. Multilevel Interconnections: Issues that Impact Competitiveness, SPIE, 1993, vol. 2090, pp. 146-160.
9. J. B. Bernstein, Y. Hua, and W. Zhang, "Laser energy limitation for buried metal cuts," IEEE Electron Device Lett., vol. 19, pp. 4-6, Jan. 1998.