Laser energy limitation for buried metal cuts

IEEE Electron Device Letters

Volumn 19, Issue 1, 1998, Pages 4-6

  Bernstein, Joseph B ^a   Hua, Yijia ^a   Zhang, Wei ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Integrated circuit interconnections; Laser materials processing applications

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; ELECTRON ENERGY LEVELS; LASER PULSES; METAL CUTTING; NEODYMIUM LASERS; Q SWITCHED LASERS; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

FOCUSED ION BEAM ANALYSIS; INTEGRATED CIRCUIT INTERCONNECTIONS; LASER CUTTING; LASER MATERIALS PROCESSING APPLICATIONS;

LASER APPLICATIONS;

EID: 0031672293     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.650334     Document Type: Article

References (7)

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7. Y. L. Shen, S. Suresh, and J. B. Bernstein. "Laser linking of metal interconnect: Analysis and design considerations," IEEE Trans. Electron Devices, vol. 43, pp. 402-410, Mar. 1996.