The relationship between opens and bridges in surface mount technology

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1391-1395

  Whalley, David C ^a   Choon, Teo Kiat ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Philips Ctr for Mfg Technology   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844313065     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)

1. Bashforth, F., and Adams, J.C., 1883, The Theories of Capillary Action, Cambridge University Press.
2. Brakke, K., 1992, "The surface evolver", Experimental Mathematics, Vol. 1, no. 2, pp141-165.
3. Ju, T., Lin, W., Lee, Y. C. and Liu, J.J., 1993, "Effects of Ceramic Ball-Grid-Array Packages' Manufacturing Variations on Solder Joint Reliability", ASME Winter Annual Meeting, ASMB 93-WA/EEP-2.
4. Klein Wassink, R.J., 1989, Soldering in Electronics, 2nd Ed. p321, Electrochemical Publications Ltd., Ayr.
5. Lea, C., 1988, A Scientific Guide to Surface Mount Technology, Electrochemical Publications Ltd., Ayr, p315.
6. Singler, T. J., 1994, "Fluid mechanical aspect of soldering process", Electronics Packaging Forum, Multiple Module Technology Issues, Edited by JE Morris, IEEE New York, pp180-185.
7. Singler, T. and Zhang, X., 1995, "Computer simulation of solder bridging phenomena", ASME EEP-Vol.10-2: Proceedings of the international intersociety electronic packaging conference - INTERpack '95, Volume 2, pp1117-1127
8. Teo, K.C., 1996a, "The origin and prevention of post reflow defects in surface mount assembly", Journal of Electronic Manufacturing Vol. 6, No.1, pp1-12.
9. Teo, K. C., 1996b, "Stencil optimization via flow control", Journal of Electronics Manufacturing, Vol.6, No.3., pp 137-153.
10. Whalley, D. C., 1996, "A model to explain SMT open circuit joints associated with adjacent solder bridges", Journal of Electronic Manufacturing, Vol. 6, No.1, pp39-44.
11. Williams, D. C., 1965, "The effect of capillary elevation in hydrometry" Journal of Scientific Instruments, Vol. 43, pp88-92.