Concave corner compensation between vertical (010)-(001) planes anisotropically etched in Si (100)

Sensors and Actuators, A: Physical

Volumn 66, Issue 1-3, 1998, Pages 299-307

  Nikpour, Behrouz ^a   Landsberger, Les M ^a   Hubbard, Ted J ^b   Kahrizi, Mojtaba ^a   Iftimie, Andreea ^a  

^a Gina Cody School of Engineering and Computer Science   (Canada)

^b DALHOUSIE UNIVERSITY   (Canada)

Author keywords

Anisotropic etch simulation; Concave corner compensation; Vibrating silicon beams

Indexed keywords

ANISOTROPY; COMPUTER SIMULATION; CRYSTAL ORIENTATION; ETCHING; LATTICE VIBRATIONS; NATURAL FREQUENCIES; SILICON WAFERS;

ANGULAR RATE MEASUREMENT SENSORS; CONCAVE CORNER COMPENSATION TECHNIQUE;

SILICON SENSORS;

EID: 0032050516     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)01753-6     Document Type: Article

References (5)

1. W.S. Choi, J.G. Smits, A method to etch undoped silicon cantilever beams, IEEE J. Microelectromech. Syst. 2 (1993) 82-86.
2. L.M. Landsberger, S. Naseh, M. Kahrizi, M. Paranjape, On hillocks generated during anisotropic etching in Si in TMAH, IEEE J. Microelectromech. Syst. 5 (1996) 106-116.
3. B. Nikpour, L.M. Landsberger, B. Haroun, M. Kahrizi, Processes to achieve vibrating beams for an angular rate measurement sensor, Proc. Canadian Conf. ECE, Calgary, Alberta, 26-29 May, 1996, pp. 76-79.
4. T.J. Hubbard, E.K. Antonnson, Emergent faces in silicon micromachining, IEEE J. Microelectromech. Syst. 3 (1993) 19-28.
5. T.J. Hubbard, E.K. Antonnson, Design of MEMS via efficient simulation of fabrication, 1996 ASME Design for Manufacturing Conf., Irvine, CA, USA, 1996, 96-DETC/DFM-1312.