A biased percolation model for the analysis of electronic-device degradation

Microelectronics Reliability

Volumn 38, Issue 4, 1998, Pages 515-521

  Gingl, Z ^a   Pennetta, C ^b,c   Kiss, L B ^d   Reggiani, L ^b,c  

^a UNIVERSITY OF SZEGED   (Hungary)

^b UNIVERSITY OF SALENTO   (Italy)

^c INFM   (Italy)

^d UPPSALA UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; PERCOLATION (SOLID STATE); RELIABILITY; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE MODELS; THIN FILMS;

BIASED PERCOLATION MODELS; CONDUCTOR-INSULATORS (CI); CONDUCTOR-SUPERCONDUCTORS (CS);

MICROELECTRONICS;

EID: 0032043683     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00230-8     Document Type: Article

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