-
1
-
-
0030383393
-
-
K.M. Tu, J.W. Mayer, J.M. Poate, L.J. Chen (Eds.), MRS, San Francisco, CA
-
A. Mouroux, R. Palmans, J. Keinonen, S.-L. Zhang, K. Maex, S. Petersson, in; K.M. Tu, J.W. Mayer, J.M. Poate, L.J. Chen (Eds.), Advanced Metallization for ULS, vol. 427, MRS, San Francisco, CA, 1996, p. 365.
-
(1996)
Advanced Metallization for ULS
, vol.427
, pp. 365
-
-
Mouroux, A.1
Palmans, R.2
Keinonen, J.3
Zhang, S.-L.4
Maex, K.5
Petersson, S.6
-
3
-
-
0028387299
-
-
J. Schmitz, S. Kang, R. Wolters, K.v.d. Aker, J. Electrochem. Soc. 141 (1994) 843.
-
(1994)
J. Electrochem. Soc.
, vol.141
, pp. 843
-
-
Schmitz, J.1
Kang, S.2
Wolters, R.3
Aker, K.V.D.4
-
4
-
-
21144477926
-
-
S. Sivaram, M.L.A. Dass, C.S. Wei, B. Tracy, R. Shukla, J. Vac. Sci. Technol. A 11 (1993) 87.
-
(1993)
J. Vac. Sci. Technol. A
, vol.11
, pp. 87
-
-
Sivaram, S.1
Dass, M.L.A.2
Wei, C.S.3
Tracy, B.4
Shukla, R.5
-
7
-
-
0023531867
-
-
E.K. Broadbent (Ed.), MRS, Palo Alto, CA
-
V.V.S. Rana, J.A. Taylor, L.H. Holschwandner, N.S. Tsai, in: E.K. Broadbent (Ed.), Tunsgten and Other Refractory Metals for VLSI Applications, vol. II, MRS, Palo Alto, CA, 1987, p. 187.
-
(1987)
Tunsgten and Other Refractory Metals for VLSI Applications
, vol.2
, pp. 187
-
-
Rana, V.V.S.1
Taylor, J.A.2
Holschwandner, L.H.3
Tsai, N.S.4
-
8
-
-
0028516801
-
-
Y.J. Lee, C.-O. Park, D.-W. Kim, J.S. Chun, J. Electron. Mater. 23 (1994) 1075.
-
(1994)
J. Electron. Mater.
, vol.23
, pp. 1075
-
-
Lee, Y.J.1
Park, C.-O.2
Kim, D.-W.3
Chun, J.S.4
-
9
-
-
0042273375
-
-
S.-L. Zhang, R. Palmans, J. Keinonen, C.S. Petersson, K. Maex, Appl. Phys. Lett. 67 (1995) 2998.
-
(1995)
Appl. Phys. Lett.
, vol.67
, pp. 2998
-
-
Zhang, S.-L.1
Palmans, R.2
Keinonen, J.3
Petersson, C.S.4
Maex, K.5
-
10
-
-
0043275793
-
-
R.C. Ellwanger, S.-Q. Wang (Eds.), MRS, Portland, OR
-
D.A. Webb, J. Hillman, F. Foster, in: R.C. Ellwanger, S.-Q. Wang (Eds.), Advanced Metallization and Interconnect Systems for VLSI applications, MRS, Portland, OR, 1995.
-
(1995)
Advanced Metallization and Interconnect Systems for VLSI Applications
-
-
Webb, D.A.1
Hillman, J.2
Foster, F.3
-
12
-
-
0043275794
-
-
R.C. Ellwanger, S.-Q. Wang (Eds.), MRS, Portland, OR
-
R. Palmans, A. Mouroux, S.-L. Zhang, S. Petersson, K. Maex, in: R.C. Ellwanger, S.-Q. Wang (Eds.), Advanced Metallization and Interconnect Systems for VLSI Applications, MRS, Portland, OR, 1995, p. 555.
-
(1995)
Advanced Metallization and Interconnect Systems for VLSI Applications
, pp. 555
-
-
Palmans, R.1
Mouroux, A.2
Zhang, S.-L.3
Petersson, S.4
Maex, K.5
-
13
-
-
0041772523
-
-
S.-L. Zhang, R. Palmans, C.S. Petersson, K. Maex, J. Appl. Phys. 78 (1995) 7313.
-
(1995)
J. Appl. Phys.
, vol.78
, pp. 7313
-
-
Zhang, S.-L.1
Palmans, R.2
Petersson, C.S.3
Maex, K.4
-
14
-
-
0023430314
-
-
P. Joubert, B. Loisel, Y. Chouen, L. Haji, J. Electrochem. Soc. 134 (1987) 2541.
-
(1987)
J. Electrochem. Soc.
, vol.134
, pp. 2541
-
-
Joubert, P.1
Loisel, B.2
Chouen, Y.3
Haji, L.4
-
15
-
-
0042273374
-
-
V.A. Wells (Ed.), MRS, New York
-
S. Sivaram, S. Chen, D. Liao, R. Shukla, D. Fraser, in: V.A. Wells (Ed.), Tungsten and Other Refractory Metals for VLSI Applications, vol. II, MRS, New York, 1988, p. 407.
-
(1988)
Tungsten and Other Refractory Metals for VLSI Applications
, vol.2
, pp. 407
-
-
Sivaram, S.1
Chen, S.2
Liao, D.3
Shukla, R.4
Fraser, D.5
-
18
-
-
1342340514
-
-
Springer, Berlin
-
I. Barin, O. Knacke, O. Kubaschewski, Thermochemical Properties of Inorganic Substances, suppl., Springer, Berlin, 1977.
-
(1977)
Thermochemical Properties of Inorganic Substances
, Issue.SUPPL.
-
-
Barin, I.1
Knacke, O.2
Kubaschewski, O.3
-
21
-
-
0041772522
-
-
G.W. Cullen (Ed.), Electrochemical Society, Princeton, NJ
-
T. Eriksson, J.-O. Carlsson, E. Niemi, M. Östling, C.S. Petersson, in: G.W. Cullen (Ed.), Proceedings of the Tenth International Conference on Chemical Vapor Deposition, Electrochemical Society, Princeton, NJ, 1987, p. 736.
-
(1987)
Proceedings of the Tenth International Conference on Chemical Vapor Deposition
, pp. 736
-
-
Eriksson, T.1
Carlsson, J.-O.2
Niemi, E.3
Östling, M.4
Petersson, C.S.5
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