The connection between sputter cleaning and adhesion of thin solid films

Surface and Coatings Technology

Volumn 80, Issue 1-2, 1996, Pages 195-199

  Koski, Kari ^a,b   Hölsä, Jorma ^a   Ernoult, Jacques ^b   Rouzaud, André ^b  

^a UNIVERSITY OF TURKU   (Finland)

^b CEA GRENOBLE   (France)

Author keywords

Adhesion; Bending test; Chemical precleaning; Sputter cleaning

Indexed keywords

ADHESION; BENDING (DEFORMATION); CHEMICAL VAPOR DEPOSITION; INTERFACES (MATERIALS); MECHANICAL TESTING; OPTICAL MICROSCOPY; PHYSICAL PROPERTIES; SECONDARY ION MASS SPECTROMETRY; SPUTTERING; SUBSTRATES; SURFACE CLEANING; SURFACE ROUGHNESS;

BENDING TEST; FILM CRACKING; NUCLEAR REACTION ANALYSIS; PHYSICAL VAPOR DEPOSITION; PRECLEANING CHEMICALS; SPUTTER CLEANING; THIN SOLID FILMS;

THIN FILMS;

EID: 0030105572     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/0257-8972(95)02710-6     Document Type: Article

References (8)

1. A. Rouzaud, E. Barbier, J. Ernoult and E. Quesnel, ICMCTF 95, May 1995, San Diego.
2. D. Tabor, Surface Physics of Materials, Vol. II, Academic Press, 1975, 509.
3. H. Weiss, Surf. Coat. Technol., 71 (1995) 201.
4. D.M. Mattox, Thin Solid Films, 124 (1985) 3.
5. J.L. Vossen, J. Phys. E. Sci. Instrum., 12 (1979) 159.
6. T. Hong, J.R. Smith and D.J. Srolovitz, Phys. Lett., 70 (1993) 615.
7. J.E. Houston and R.D. Bland, J. Appl. Phys., 44 (1973) 2504.
8. M.D. Thouless, Thin Solid Films, 181 (1989) 397.