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Volumn 19, Issue 1, 1998, Pages 1-3

Plasma charging damage on ultrathin gate oxides

Author keywords

Charging damage; Diode protection; Oxide scaling; Reliability; Thin gate oxide

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; ELECTRON DEVICE MANUFACTURE; ION IMPLANTATION; LEAKAGE CURRENTS; OXIDES; REACTIVE ION ETCHING; RELIABILITY; SEMICONDUCTOR PLASMAS;

EID: 0031646677     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.650333     Document Type: Article
Times cited : (28)

References (10)
  • 1
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    • (1989) VLSI Technol. , pp. 73
    • Shone, F.1    Wu, K.2    Shaw, J.3    Hokelet, E.4    Mittal, S.5    Haranahalli, A.6
  • 2
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    • Modeling oxide thickness dependence of charging damage by plasma processing
    • Nov.
    • H. Shin, K. Noguchi, and C. Hu, "Modeling oxide thickness dependence of charging damage by plasma processing." IEEE Electron Device Lett., vol. 14, p. 509, Nov. 1993.
    • (1993) IEEE Electron Device Lett. , vol.14 , pp. 509
    • Shin, H.1    Noguchi, K.2    Hu, C.3
  • 3
    • 0026203864 scopus 로고
    • Thin oxide charging current during plasma etching of aluminium
    • Aug.
    • H. Shin, C. C. King, T. Horiuchi, and C. Hu, "Thin oxide charging current during plasma etching of aluminium," IEEE Electron Device Lett., vol. 12, p. 404, Aug. 1991.
    • (1991) IEEE Electron Device Lett. , vol.12 , pp. 404
    • Shin, H.1    King, C.C.2    Horiuchi, T.3    Hu, C.4
  • 4
    • 0029697536 scopus 로고    scopus 로고
    • Gate oxide thickness dependence of RIE-induced damage on N-channel MOSFET reliability
    • A. Joshi, L. Chung, B. W. Min, and D.L. Kownog. "Gate oxide thickness dependence of RIE-induced damage on N-channel MOSFET reliability." in Int. Reliab. Phys. Symp., 1996, p. 300.
    • (1996) In Int. Reliab. Phys. Symp. , pp. 300
    • Joshi, A.1    Chung, L.2    Min, B.W.3    Kownog, D.L.4
  • 5
    • 3643064024 scopus 로고
    • Plasma-damaged oxide reliability sudy correlating both hot-carrier injection and time-dependent dielectric breakdown
    • Feb.
    • X. Li, J. T. Hsu, P. Aum, D. Chan, J. Rembeski, and C. R. Viswanathan. "Plasma-damaged oxide reliability sudy correlating both hot-carrier injection and time-dependent dielectric breakdown." IEEE Electron Device Lett., vol. 14, p. 91, Feb. 1993.
    • (1993) IEEE Electron Device Lett. , vol.14 , pp. 91
    • Li, X.1    Hsu, J.T.2    Aum, P.3    Chan, D.4    Rembeski, J.5    Viswanathan, C.R.6
  • 6
    • 0028530411 scopus 로고
    • Degradation of submicron N-channel MOSFET hot electron reliability due to edge damage from polysiticon gate plasma etching
    • Oct.
    • T. Gu, O. O. Awadelkarim, S. J. Fonash, and Y. D. Chan, "Degradation of submicron N-channel MOSFET hot electron reliability due to edge damage from polysiticon gate plasma etching." IEEE Electron Device Lett., vol. 15, p. 396, Oct. 1994.
    • (1994) IEEE Electron Device Lett. , vol.15 , pp. 396
    • Gu, T.1    Awadelkarim, O.O.2    Fonash, S.J.3    Chan, Y.D.4
  • 7
    • 0030387118 scopus 로고    scopus 로고
    • Gate oxide scaling limits and projection
    • C. Hu, "Gate oxide scaling limits and projection," in IEDM Tech. Dig., 1996, p. 319.
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    • Hu, C.1
  • 10
    • 0027593004 scopus 로고    scopus 로고
    • Monitoring plasma-process induced damage in thin oxide
    • Feb.
    • H. Shin and C. Hu, "Monitoring plasma-process induced damage in thin oxide," IEEE Trans. Semiconduct. Manufact., vol. 6, p. 96, Feb. 1996.
    • (1996) IEEE Trans. Semiconduct. Manufact. , vol.6 , pp. 96
    • Shin, H.1    Hu, C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.