Effect of thermal residual stress on the measurement of the adhesion between polyimide and underfill using an asymmetric double cantilever beam specimen

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 97-102

  Jiao, Jinbao ^a   Sha, Yan ^b   Gurumurthy, Charan K ^c   Hui, Chung Yuen ^b   Kramer, Edward J ^c   Børgesen, Peter ^d  

^a MOTOROLA INC   (United States)

^b Department of Obstetrics Gynecology   (United States)

^c Cornell University   (United States)

^d UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CALCULATIONS; ELECTRONICS PACKAGING; EPOXY RESINS; FRACTURE; INTERFACES (MATERIALS); INTERFACIAL ENERGY; RESIDUAL STRESSES; THERMAL STRESS;

ASYMMETRIC DOUBLE CANTILEVER BEAM; CRITICAL STRAIN ENERGY RELEASE RATE; DIRECT CHIP ATTACH; INTERFACIAL FRACTURE ENERGY; THERMAL RESIDUAL STRESS;

POLYIMIDES;

EID: 0031356965     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)

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