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Volumn , Issue , 1994, Pages 53-58
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Advanced micro air-cooling systems for high density packaging
a
a
SIEMENS AG
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
AIR;
COOLANTS;
COOLING SYSTEMS;
DENSITY (SPECIFIC GRAVITY);
ETCHING;
FANS;
HEAT CONDUCTION;
HEAT EXCHANGERS;
PERFORMANCE;
SURFACES;
THREE DIMENSIONAL;
ADVANCED MICRO AIR COOLING;
HEAT TRANSFER COEFFICIENT;
HIGH DENSITY PACKAGING;
LIQUID COOLING;
PENTIUM PROCESSOR;
PLASMA TREATMENT;
RELATIVE ION ETCHING;
THERMOSYPHON;
ELECTRONICS PACKAGING;
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EID: 0028338084
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (25)
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References (10)
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