High density organic flip chip package substrate technology

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1089-1097

  Petefish, W G ^a   Noddin, D B ^a   Hanson, D A ^a   Gorrell, R E ^a   Syvester, M F ^a  

^a W L GORE AND ASSOCIATES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COST EFFECTIVENESS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LAMINATED COMPOSITES; NETWORK COMPONENTS; DIELECTRIC MATERIALS; POLYTETRAFLUOROETHYLENES; SUBSTRATES;

FABRICATION TECHNOLOGIES; FLIP-CHIP CONFIGURATIONS; HIGH-PERFORMANCE LOGIC; MATERIALS OF CONSTRUCTIONS; POLYTETRAFLUOROETHYLENE (PTFE); RELIABILITY CHARACTERIZATION; THERMAL CYCLING RELIABILITY; THERMO-MECHANICAL CHARACTERIZATION;

SUBSTRATES; ELECTRONICS PACKAGING;

ORGANIC SUBSTRATES;

EID: 0031633694     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678850     Document Type: Conference Paper

References (15)

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8. Korleski, Joseph, et al, ibid.
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11. Minamizawa, Masaharu, et al, ibid.
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