Electrical evaluation of flip-chip package alternatives for next generation microprocessors

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 666-673

  Darnauer, J ^a   Chengson, D ^a   Schmidt, B ^a   Priest, E ^a   Petefish, B ^a   Hanson, D ^a   Gore, W L ^a  

^a HEWLETT PACKARD ENTERPRISE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; CERAMIC MATERIALS; CHIP SCALE PACKAGES; FLIP CHIP DEVICES; NETWORK COMPONENTS; CAPACITORS; ELECTRIC NETWORK ANALYSIS; INTEGRATED CIRCUIT TESTING; MICROPROCESSOR CHIPS; THIN FILMS;

BYPASS CAPACITORS; CERAMIC PACKAGE; ELECTRICAL EVALUATIONS; ELECTRICAL PERFORMANCE; FLIP-CHIP PACKAGES; LAND GRID ARRAYS; ON-CHIP CAPACITORS; SIMULTANEOUS SWITCHING OUTPUTS;

MICROPROCESSOR CHIPS; ELECTRONICS PACKAGING;

BALL GRID ARRAYS (BGA); LAND GRID ARRAYS (LGA); SIMULTANEOUS SWITCHING OUTPUT (SSO);

EID: 0031625565     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678769     Document Type: Conference Paper

References (5)

1. MIPS Technologies Inc., "R10000 microprocessor user's manual-version 2. 0, " December 4 1996. http://www. sgi. com/MIPS/products/rlOk.
2. MIPS Technologies Inc., "R4000/R4400 Microprocessor User's Manual-2nd edition, " October 1994. http://www. sgi. com/MIPS/products/r4400.
3. H. Bakoglu, Circuits, Interconnections, Packaging for VLSI. Addison Wesley, 1990.
4. J. Libous and D. O'Connor, "Measurement, modeling, simulation of flip-chip CMOS ASIC simultaneous switching noise on a multilayer ceramic BGA, " IEEE Transaction on Components, Packaging, Manufacturing Technology part B, vol. 20, pp. 266-271, August 1997.
5. J. Bandyopadhyay, P. Chahal, M. Swaninathan, "Importance of damping and resonance in thin-film integrated decoupling capacitor design, " in IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 31-34, 1997.