New composite organic dielectric for high performance flip chip single chip packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1015-1021

  Korleski, Joseph E ^a   Gorrell, Robin E ^a   Bowen, Christopher P ^a   Noddin, David B ^a  

^a W L GORE AND ASSOCIATES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; DIELECTRIC MATERIALS; DIMENSIONAL STABILITY; FLIP CHIP DEVICES; GLASS TRANSITION; PERMITTIVITY; PRINTED CIRCUIT BOARDS; RELIABILITY; THERMAL EFFECTS; THERMAL EXPANSION;

COMPOSITE ORGANIC DIELECTRICS; FLIP CHIP SINGLE CHIP PACKAGES;

ELECTRONICS PACKAGING;

EID: 0030700033     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)