Use of compliant adhesives in the large area processing of MCM-D substrates

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 895-899

  Sitaraman, S K ^a,c   Sundararaman, V ^a   Manjula, S ^a   Wong, C P ^b   Wu, J ^b   Pike, R T ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINA; ALUMINUM OXIDE; NETWORK COMPONENTS; PALLETS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SUBSTRATES; THERMODYNAMIC STABILITY; THIN FILMS;

LARGE-AREA PROCESSING; MATERIAL PARAMETER; REWORKABILITY; STRINGENT REQUIREMENT; THERMO-MECHANICAL RESPONSE; THERMO-MECHANICAL STRESS; THIN-FILM PROCESSING; TIME REDUCTION;

SUBSTRATES; MULTICHIP MODULES;

REWORKABILITY; THERMOMECHANICAL RESPONSE;

EID: 0031620455     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678814     Document Type: Conference Paper

References (9)

1. Lie Van, G., Ludlow, P., "MCM-D Consortium, " Proceedings of the 1995 International Conference on Multichip Modules, SPIE Vol. 2575, pp. 249-52.
2. MCM-D Consortium World Wide Web Page: Http://eto. sysplan. com/ETO/El-Packaging/Projects/TRP/mcm-d. html
3. Center for Information and Numerical Data Analysis and Synthesis (CINDAS), CINDAS Report 113, Purdue University, West Lafayette, IN, March 1995.
4. Wong, C. P., Pike, R. T., Wu, J., Lee, Y. K., "Preparation and Characterization of Reworkable High Temperature Adhesives for Microelectronic Applications, " To be submitted to IEEE Transactions on Components, Packaging, Manufacturing Technology.
5. Wong, C. P., "Ultra-thermal Stable Adhesives for MCM-D Applications, " U. S. patent (in preparation).
6. Suhir, E., "Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies, " Proceedings of the 1986 International Symposium on Microelectronics, pp. 383-92.
7. Dunne, R. C., Sitaraman, S. K., "Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM), " ASME Journal of Electronic Packaging, Vol. 119 (1997), pp. 197-203.
8. Timoshenko, S. P., "Analysis of Bi-Metal Thermostats, " Journal of the Optical Society of America, Vol. 23 (1925), pp. 233-255.
9. Michaelides, S., Sitaraman, S. K., "Effect of Material and Geometry Parameters on the Thermo-Mechanical Reliability of Flip-Chip Assemblies, " to be presented at the ITHERM'98 Sixth Inter society Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 1998.