Highly reliable plastic packaging for laser diode and photodiode modules used for access network

Electronics Letters

Volumn 33, Issue 25, 1997, Pages 2158-2159

  Fukuda, M ^a   Ichikawa, F ^a   Yamada, Y ^a   Inoue, Y ^a   Kato, K ^a   Sato, H ^a   Sugie, T ^b   Toba, H ^a   Yoshida, J ^a  

^a NTT CORPORATION   (Japan)

^b NTT Access Network Service Systems Laboratories   (Japan)

Author keywords

Plastic packaging; Reliability; Semiconductor junction lasers

Indexed keywords

DIELECTRIC FILMS; FIBER OPTIC NETWORKS; FLIP CHIP DEVICES; OPTICAL WAVEGUIDES; PHOTODIODES; PLASTICS APPLICATIONS; REFRACTIVE INDEX; SEMICONDUCTOR LASERS; SEMICONDUCTOR QUANTUM WELLS; TRANSMITTERS;

OPTICAL TRANSMITTERS; PLANAR LIGHTWAVE CIRCUIT; PLASTIC PACKAGING; SEMICONDUCTOR JUNCTION LASERS;

ELECTRONICS PACKAGING;

EID: 0031553158     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19971365     Document Type: Article

References (8)

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