Plastic packaging of semiconductor laser diodes

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1101-1108

  Fukuda, Mitsuo ^a   Ichikawa, Fumio ^a   Sato, Hirotsugu ^a   Hibino, Yoshinori ^a   Moriwaki, Kazuyuki ^a   Tohno, Shunichi ^a   Sugie, Toshihiko ^a   Yoshida, Junichi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; COST EFFECTIVENESS; DURABILITY; ELECTRONICS PACKAGING; ENVIRONMENTAL TESTING; EPOXY RESINS; MECHANICAL TESTING; OPTICAL COMMUNICATION; PLASTICS APPLICATIONS; PLASTICS MOLDING; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE;

COMMERCIAL TRANSMISSION SYSTEMS; ENDURANCE TESTING; HERMETICALLY SEALED MODULES; NON HERMETIC PACKAGING; PLASTIC PACKAGING; SEMICONDUCTOR LASER MODULES;

SEMICONDUCTOR LASERS;

EID: 0029710410     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)