Electrical conduction through compound semiconductor wafer bonded interfaces

Journal of Crystal Growth

Volumn 174, Issue 1-4, 1997, Pages 213-219

  Vanderwater, D A ^a   Kish, F A ^a   Peansky, M J ^a   Rosner, S J ^b  

^a HEWLETT PACKARD COMPANY   (United States)

^b HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

Device characterization; LEDs; Semiconductor wafer bonding

Indexed keywords

BONDING; ELECTRIC RESISTANCE; INTERFACES (MATERIALS); MICROSCOPIC EXAMINATION; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING INDIUM PHOSPHIDE; SUBSTRATES;

SEMICONDUCTOR WAFER BONDING;

LIGHT EMITTING DIODES;

EID: 0031547229     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0248(96)01107-4     Document Type: Article

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