Non-volatile memories using SrBi2Ta2O9 ferroelectrics

Integrated Ferroelectrics

Volumn 17, Issue 1-4, 1997, Pages 21-30

  Jones, R E ^a   Chu, P Y ^a   Jiang, B ^a   Melnick, B M ^a   Taylor, D J ^a   White, B E ^a   Zafar, S ^a   Price, D ^b   Zurcher, P ^a   Gillespie, S J ^a   Otsuki, T ^c   Sumi, T ^c   Judai, Y ^c   Uemoto, Y ^c   Fujii, E ^c   Hayashi, S ^c   Moriwaki, N ^c   Azuma, M ^c   Shimada, Y ^c   Arita, K ^c   Hirano, H ^c   Nakane, J ^c   Nakakum, T ^c   Kano, G ^c   more..

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

^c PANASONIC CORPORATION   (Japan)

Author keywords

Ferroelectric; Non volatile memory; Process integration

Indexed keywords

DEPOSITION; FERROELECTRIC MATERIALS; PEROVSKITE; STRONTIUM COMPOUNDS;

FIRE DEPOSITION; PROCESS INTEGRATION; SPIN COAT DEPOSITION; STRONTIUM BARIUM TANTALATE;

NONVOLATILE STORAGE;

EID: 0031373231     PISSN: 10584587     EISSN: None     Source Type: Journal    
DOI: 10.1080/10584589708012978     Document Type: Article

References (12)

1. [1. ] C. A. Paz de Araujo, J. D. Cuchiaro, M. C. Scott, and L. D. McMillan, International Patent Publication No. WO 93/12542 (24 June 1993).
2. [2. ] K. Amanuma, T. Hase, and Y. Miyasaka, Appl. Phys. Lett., 66, 221 (1995).
3. [3. ] K. Amanuma, T. Kuno, and J. Cuchiaro, Mat. Res. Soc. Symp. Proc., 433, 85 (1996)
4. [4. ] C. D. Gutleben, Mat. Res. Soc. Symp. Proc., 433, 109 (1996).
5. [5. ] P. Y. Chu, D. J. Taylor, P. Zurcher, B. E. White, Jr., S. Zafar, B. Jiang, B. Melnick, R. E. Jones, Jr., and S. J. Gillespie, Intern. Symp. on Applications of Ferroelectrics, Aug. 18-21, 1996 (East Brunswick, NJ), to be published in proceedings.
6. [6. ] P. Y. Chu, R. E. Jones, Jr., P. Zurcher, D. J. Taylor. B. Jiang, and S. J. Gillespie, J. Mater. Res., 11, 1065 (1996).
7. [7. ] D. J. Taylor, R. E. Jones, Y. T. Lii, P. Zurcher, P. Y. Chu, and S. J. Gillespie, Mat. Res. Sac. Symp. Proc., 433, 145 (1996).
8. [8. ] R. E. Jones, Jr., P. D. Maniar, R. Moazzami, P. Zurcher, J. W. Witowski, Y. T. Lii, P. Chu, and S. J. Gillespie, Thin Solid Films, 270, 584 (1995).
9. [9. ] P. Zurcher, R. E. Jones., P. Chu, D. J. Taylor, B. E. White, Jr., S. Zafar, B. Jiang, Y. T. Lii, and S. J. Gillespie, IEEE Trans. Components, Packaging, and Manufacturing Technology, (to be published).
10. [10. ] H. Yamaguchi, T. Iizuki, H. Koga, K. Takemura, S. Sone, H. Yabuta, S. Yamamichi, P-Y. Lesaicherre, M. Suzuki, Y. Kojima, K. Nakajima, N. Kasai, T. Sakjima, Y. Kato, Y. Miyasaki, M. Yoshida, and S. Nishimoto, IEDM Techn. Digest, p. 675 (1996).
11. [11. ] S. L. Miller, J. R. Schwank. R. D. Nasby, and M. S. Rodgers, J. Appl. Phys., 70, 2849 (1992).
12. [12. ] B. Jiang, J. C. Lee, P. Zurcher, and R. E. Jones, Jr., Integrated Ferroelectrics, (to be published).