Laser machining of ceramics and silicon for MCM-D applications

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 173-176

  Glaw, V ^a   Hahn, R ^a   Paredes, A ^a   Hein, U ^a   Ehrmann, O ^a   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HEAT SINKS; LASER APPLICATIONS; MACHINING; MULTICHIP MODULES; NEODYMIUM LASERS; OPTIMIZATION; SILICON; STABILITY; SUBSTRATES;

LASER MACHINING; MECHANICAL STABILITY; PROCESS OPTIMIZATION;

CERAMIC MATERIALS;

EID: 0030645977     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (30)