PACKAGING TECHNOLOGY FOR THE NEC SX SUPERCOMPUTER

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1985, Pages 192-198

  Watari, Toshihiko ^a   Murano, Hiroshi ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

DATA STORAGE UNITS; INTEGRATED CIRCUITS, LSI - COOLING; LOGIC DESIGN - GATES; THERMAL CONDUCTIVITY;

ARITHMETIC PROCESSOR; LIQUID COOLING MODULE; MILLION FLOATING POINT OPERATIONS (FLOPS); MULTI-CHIP PACKAGE;

COMPUTERS;

EID: 0022228035     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)