Processing diagrams for polymeric die attach adhesives

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 536-543

  Hsiung, J C ^a   Pearson, R A ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; DIFFERENTIAL SCANNING CALORIMETRY; OPTICAL MICROSCOPY; POLYMERS; SOLDERING; THERMOGRAVIMETRIC ANALYSIS;

DYNAMIC MECHANICAL ANALYSIS (DMA); POLYMERIC DIE ATTACH ADHESIVES;

MULTICHIP MODULES;

EID: 0030646686     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)