Isothermal fatigue crack growth in flip chip solder joints

American Society of Mechanical Engineers, EEP

Volumn 11, Issue , 1995, Pages 231-236

  Korhonen, M A ^a   Liu, Tao ^a   Li, Che Yu ^a  

^a Cornell Univ ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DEFORMATION; FATIGUE OF MATERIALS; FATIGUE TESTING; FLIP CHIP DEVICES; LEAD ALLOYS; MATHEMATICAL MODELS;

ISOTHERMAL FATIGUE CRACK GROWTH;

SOLDERED JOINTS;

EID: 0029425061     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)