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Volumn 11, Issue , 1995, Pages 13-23
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Interfacial stress singularity analysis - a case study for plastic encapsulated IC packages
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACK INITIATION;
ENCAPSULATION;
FINITE ELEMENT METHOD;
INTEGRATED CIRCUITS;
INTERFACES (MATERIALS);
MATHEMATICAL MODELS;
PLASTIC COATINGS;
SHEET MOLDING COMPOUNDS;
STRESS ANALYSIS;
STRESS INTENSITY FACTORS;
THERMAL EFFECTS;
THERMAL STRESS;
INTERFACIAL STRESS SINGULARITY ANALYSIS;
LEAD FRAMES;
PLASTIC ENCAPSULATION;
ELECTRONICS PACKAGING;
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EID: 0029426314
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (15)
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References (13)
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