Finite Element Analysis of MMIC Structures and Electronic Packages Using Absorbing Boundary Conditions

IEEE Transactions on Microwave Theory and Techniques

Volumn 42, Issue 3, 1994, Pages 441-449

  Mittra, Raj ^b  

^a Swanson Analysis System Inc ^*  (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FIELD EFFECTS; ELECTRIC NETWORK PARAMETERS; ELECTRIC WIRING; ELECTROMAGNETIC WAVE PROPAGATION; ELECTROMAGNETIC WAVE SCATTERING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROSTRIP DEVICES; SEMICONDUCTOR DEVICE STRUCTURES;

ABSORBING BOUNDARY CONDITIONS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SCATTERING PARAMETERS;

WAVEGUIDES;

EID: 0028396132     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.277438     Document Type: Article

References (12)

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