Microstructural investigation of Sn-Ag and Sn-Pb-Ag solder joints

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 1, Issue , 1996, Pages 195-205

  Chada, Srinivas ^a   Herrmann, Ann ^a   Laub, Werner ^a   Fournelle, Raymond ^a   Shangguan, Dongkai ^a   Achari, Achyuta ^a  

^a MARQUETTE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COARSENING; DENDRITES; ENERGY DISPERSIVE SPECTROSCOPY; MELTING POINTS; MICROHARDNESS MEASUREMENT; REFLOW SOLDERING; SOLDER PASTE;

ANNEALING; COOLING; COPPER; EUTECTICS; HARDNESS; INTERMETALLICS; MECHANICAL VARIABLES MEASUREMENT; METALLOGRAPHIC MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLIDIFICATION; TIN ALLOYS;

SOLDERED JOINTS;

EID: 0029711578     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)