Experimental evaluation of moisture-induced failures of surface mount plastic packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 56-67

  Ilyas, Qazi S M ^a   Potter, Mark E ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MOISTURE INDUCED FAILURES; PLASTIC ELECTRONIC PACKAGES; RELIABILITY MONITORING PROGRAMS; SOLDER REFLOW;

FAILURE ANALYSIS; INTEGRATED CIRCUIT TESTING; MOISTURE; MOS DEVICES; PLASTIC PRODUCTS; SOLDERING; SURFACE MOUNT TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0029696687     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)