Electromigration reliability improvement of W-plug vias by titanium layering

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1994, Pages 173-177

  Graas, Carole D ^a   Le, Huy A ^a   McPherson, Joe W ^a   Havemann, Robert H ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL MODIFICATION; DOPING (ADDITIVES); ELECTRON TRANSPORT PROPERTIES; ETCHING; GRAIN BOUNDARIES; INTERFACES (MATERIALS); METALLIZING; SHEET METAL; TITANIUM; TUNGSTEN;

DOUBLE LEVEL METALLIZATION SYSTEMS; ELECTROMIGRATION RELIABILITY; TITANIUM LAYERING; TUNGSTEN PLUG VIAS;

ELECTRIC CONNECTORS;

EID: 0028195444     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/relphy.1994.307840     Document Type: Conference Paper

References (6)