Using double-sided scrubbing systems for multiple general fab applications

MICRO

Volumn 14, Issue 9, 1996, Pages 55-62

  Hymes, Diane J ^a   Malik, Igor J ^a  

^a OnTrak Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 8344275042     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Myers TL, Fury MA, and Krusell WC, "Post-Tungsten CMP Cleaning Issues: Issues and Solutions," Solid State Technology, 59(10):59-64, 1995.
2. De Larios JM, and Krusell WC, "The Challenges of Post-Metal Polish Clean," presented to Semicon/Southwest, Austin, TX, October 1995.
3. Roy SR, Ali I, Shinn G, et al., "Postchemical-Mechanical Planarization Cleanup Process for Interlayer Dielectric Films," Journal of the Electrochemical Society, 142(1):216-226, 1995.
4. Krusell W, De Larios J, and Zhang J, "Mechanical Brush Scrubbing for Post-CMP Clean," Solid State Technology, 109(6):109-114, 1995.
5. See, e.g., Adamson AW, Physical Chemistry of Surfaces, fifth ed, New York, Wiley, 1990.
6. Jan DE, and Raghavan S, "Electrokinetic Characteristics of Nitride Wafers in Aqueous Solution and Their Impact on Particulate Deposition," Journal of the Electrochemical Society, 141 (9):2465-2469, 1994.
7. Krusell WC, Malik IJ, Mohr, F, and Hymes DJ, "Double-Side Scrubbing Beyond Post-CMP Cleaning," presented to the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing, Electrochemical Society Meeting, Chicago, Fall 1995.