Effect of load-mix on fatigue crack growth in 63sn-37pb solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 2, 1997, Pages 114-118

  Yao, D ^a   Shang, J K ^a  

^a United States of America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRACK PROPAGATION; FATIGUE OF MATERIALS; FATIGUE TESTING; INTERFACES (MATERIALS); STRAIN RATE; STRESS ANALYSIS; STRESS INTENSITY FACTORS; TIN ALLOYS;

FATIGUE CRACK GROWTH; LOAD MIX;

SOLDERED JOINTS;

EID: 0031168914     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792212     Document Type: Article

References (15)

1. Lau, J. H., Rice, D. W., and Avery, P. A., “Elastoplastic Analysis of Surface-Mount Solder Joints,” IEEE Trans. Comp. Hybrids, Manuf. Technoi, Vol. CHMT-10, No. 3, 1987, pp. 346-357.
2. Sandor, B. I., “Life Prediction of Solder Joints: Engineering Mechanics Method,” Solder Mechanics: a State of the Art Assessment, D. R. Frear, W. B. Jones, and K. R. Kinsman, eds., TMS Warrendale, PA, 1991, pp. 363-419.
3. Kilinski, T. J., Lesniak, J. R., and Sandor, B. I., “Modern Approaches to Fatigue Life Prediction of SMT Solder Joints,” Solder Joint Reliability: Theory and Applications, J. H. Lau, ed. Von Nostrand Reinhold, NY, 1991, pp. 384-405.
4. Solomon, H. D., “Life Prediction and Accelerated Testing,” The Mechanics of Solder Alloy Interconnects, D. R. Frear, S. N. Burchett, H. S. Morgan, and J. H. Lau, eds., Von Nostrand Reinhold, New York, 1994, pp. 199-313.
5. Evans, A. G., and Hutchinson, J. W., “Effects of Non-planarity on the Mixed Mode Fracture Resistance of Bimaterial Interfaces,” Acta Metall, Vol. 37, No. 3, 1989, pp. 909-916.
6. Zhang, Z., and Shang, J. K., “Subcritical Crack Growth at Bi-material Interfaces: Part I, Flexural Peel Technique,” Metall. Mater. Trans. A, Vol. 27A, No. 1, 1996.
7. Yao, D., Zhang, Z., and Shang, J. K., “Experimental Technique for Studying Mixed-Mode Crack Growth in Solder Joints,” Proc. of 1995 ASME Winter Meeting, Nov. 12-17, 1995, San Francisco, CA, Paper No. 95-WA/EEP-12.
8. Liaw, P. K., Logsdon, W. A., and Burke, M. A., “Fatigue Crack Propagation Behavior of 63Sn-37Pb Solder,” Scripta Metall., Vol. 23, 1989, pp. 747-752.
9. Logsdon, W. A., Liaw, P. K., and Burke, M. A., “Fracture Behavior of 63Sn-37Pb Solder,” Eng. Fract. Mech., Vol. 36, No. 2, 1990, pp. 183-218.
10. Guo, Z., and Conrad, H., “Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints,” ASME Journal of Electronic Packaging, Vol. 115, 1993, pp. 159- 164.
11. Cao, H. C., and Evans, A. G., “A Experimental Study of the Fracture Resistance of Bimaterial Interfaces,” Mech. Mater., Vol. 7, 1989, pp. 295-304.
12. Cannon, R. M., Dalgleish, B. J., Dauskardt, R. H., Oh, T. S., and Ritchie, R. O., “Cyclic Fatigue Crack Propagation Along Ceramic/Metal Interfaces,” Acta Metall. Mater., Vol. 39, 1991, pp. 2145-2156.
13. Reimanis, I. E., Dalgleish, B. J., Brahy, M., Ruhle, M., and Evans, A. G., “Effects of Plasticity on the Crack Propagation Resistance of a Metal/Ceramic Interface,” Acta Metall. Mater., Vol. 38, 1990, pp. 2645-2652.
14. Yao, D., and Shang, J. K., “Effect of Aging on Fatigue Crack Growth at Sn-Pb/Cu Interfaces,” Metall. Mater. Trans., A, 26A, 1995, pp. 2677-2685.
15. Yao, D., and Shang, J. K., “Effect of Cooling Rate on Interfacial Fatigue-Crack Growth in Sn-Pb Solder Joint,” IEEE Trans. Comp. Packag. and Manuf. Technoi.-Part B, Vol. 19, No. 1, 1996