Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 5 A, 1997, Pages 2784-2787

  Yokoi, Hideki ^a   Mizumoto, Tetsuya ^a   Maru, Koichi ^a   Naito, Yoshiyuki ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Absorption loss; Garnets; Wafer direct bonding; X ray photoelectron spectroscopy rib waveguide

Indexed keywords

MAGNETIC GARNETS; RIB WAVEGUIDES; WAFER DIRECT BONDING;

ANNEALING; BONDING; GARNETS; HYDROGEN; LIGHT ABSORPTION; MAGNETIC MATERIALS; MAGNETOOPTICAL DEVICES; NITROGEN; SEMICONDUCTING GALLIUM COMPOUNDS; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTOR DEVICE MANUFACTURE; X RAY PHOTOELECTRON SPECTROSCOPY;

OPTICAL WAVEGUIDES;

EID: 0031147089     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.2784     Document Type: Article

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