Multichip Assembly with Flipped Integrated Circuits

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 12, Issue 4, 1989, Pages 650-657

  Heinen, K Gail ^a   Schroen, Walter H ^a   Edwards, Darvin R ^a   Wilson, Arthur M ^a   Stierman, Roger J ^a   Lamson, Michael A ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTRONICS PACKAGING;

FLIPPED INTEGRATED CIRCUITS; FLIPPED-CHIP INTERCONNECTION; MULTICHIP ASSEMBLY; ON-CHIP INTERCONNECTION METALLIZATION; PLATED COPPER BUMPS; WAFER FABRICATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0024891816     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.49029     Document Type: Article

References (12)

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