New metal board for COB, Multi-chip, TAB and Philip-chip

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1993, Pages 555-559

  Okuno, Atsushi ^a   Oyama, Noritaka ^a   Hashimoto, Tsunekazu ^a   Kinoshita, Hiroshi ^a   Shida, Hiroshi ^a  

^a Japan Rec Co Ltd ^*  (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; MODULAR CONSTRUCTION; RELIABILITY; SEMICONDUCTOR DEVICES;

CHIP ON BOARD; FLIP CHIP; SILICON CHIPS;

PRINTED CIRCUIT BOARDS;

EID: 0027284651     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)