Assessment of mechanical reliability of a die-bonded chip package during chip encapsulation and accelerated thermal cycling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1993, Pages 670-678

  Ramakrishna, K ^a   Lo, J C ^a   Guo, Y ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; FINITE ELEMENT METHOD; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; THERMAL EFFECTS;

ACCELERATED THERMAL CYCLING; SEMICONDUCTOR CHIPS;

ELECTRONICS PACKAGING;

EID: 0027294572     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (41)