Effective methods to prevent stiction during post-release-etch processing

Proceedings of the IEEE Micro Electro Mechanical Systems

Volumn , Issue , 1995, Pages 94-99

  Abe, Takeshi ^a   Messner, William C ^a   Reed, Michael L ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LIQUIDS; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; MICROMACHINING; NUMERICAL ANALYSIS; PRESSURE; SEMICONDUCTING SILICON; STABILITY; STICTION; SURFACE TENSION; TEMPERATURE;

CANTILEVERED BEAMS; CLAMPED BEAMS; LAPLACE PRESSURE FORCES; POST RELEASE ETCH PROCESSING; SILICON MICROMACHINING; THREE DIMENSIONAL LAPLACE EQUATION;

DRY ETCHING;

EID: 0029203991     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)