|
|
Volumn 27 A, Issue 1, 1996, Pages 213-219
|
|
Subcritical crack growth at bimaterial interfaces: Part II. Microstructural effects on fracture resistance of metal/ceramic interfaces
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ALUMINA;
ALUMINUM ALLOYS;
BONDING;
CRACK PROPAGATION;
FRACTURE TOUGHNESS;
HEAT TREATMENT;
MICROSTRUCTURE;
TOUGHNESS;
YIELD STRESS;
ALUMINUM COPPER ALLOY;
BIMATERIAL INTERFACES;
FLEXURAL PEEL TECHNIQUE;
FRACTURE RESISTANCE;
INITIATION TOUGHNESS;
METAL CERAMIC INTERFACE;
MICROSTRUCTURAL EFFECT;
SUBCRITICAL CRACK GROWTH;
INTERFACES (MATERIALS);
|
|
EID: 0029775509
PISSN: 10735623
EISSN: None
Source Type: Journal
DOI: 10.1007/BF02647761 Document Type: Article |
|
Times cited : (6)
|
|
References (28)
|
