Thin film silicon on insulator substrates and their application to integrated circuits

Journal of Electronic Materials

Volumn 25, Issue 1, 1996, Pages 13-21

  Wilson, S R ^a   Wetteroth, T ^a   Hong, S ^a   Shin, H ^a   Hwang, B Y ^a   Foerstner, J ^a   Racanelli, M ^a   Huang, M ^a   Shin, H C ^a  

^a MOTOROLA INC   (United States)

Author keywords

Integrated circuits; Si; Thin film silicon on insulator

Indexed keywords

ELECTRIC PROPERTIES; INTEGRATED CIRCUITS; SUBSTRATES; THIN FILM DEVICES;

DEVICE PERFORMANCE; JUNCTION CAPACITANCE; JUNCTION LEAKAGE; PROCESS INTEGRATION; THIN FILM SILICON ON INSULATOR DEVICES (TFSOI);

SILICON ON INSULATOR TECHNOLOGY;

EID: 0029678903     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02666168     Document Type: Article

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