Potential of total reflection and grazing incidence XRF for contamination and process control in semiconductor fabrication

Mikrochimica Acta

Volumn 133, Issue 1-4, 2000, Pages 65-68

  Weiss, Cornelia ^a   Knoth, Joachim ^b   Schwenke, Heinrich ^b   Geisler, Holm ^a   Lerche, Jürgen ^a   Schulz, Rüdiger ^a   Ullrich, Hans Jürgen ^c  

^a IBM MICROELECTRONICS   (United States)

^b INSTITUTE OF MATERIALS RESEARCH   (Germany)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

EFTEM; Metal contamination; Si wafer; TXRF; VPD ICP MS

Indexed keywords

EID: 0012388841     PISSN: 00263672     EISSN: None     Source Type: Journal    
DOI: 10.1007/s006040070073     Document Type: Article

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