The Application of FIB Voltage-Contrast Technique Combining with TEM on Subtle Defect Analysis: Via Delamination after TC

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1997-October, Issue , 1997, Pages 115-119

  Yang, Xiaoyu ^a   Song, X ^a  

^a CYPRESS SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; ION BEAMS; TESTING; TRANSMISSION ELECTRON MICROSCOPY; VOLTAGE MEASUREMENT;

DEFECT ANALYSIS; DEFECT MECHANISMS; ELECTRICAL TESTING; LAYOUT ANALYSIS; OPEN DEFECTS; PROCESS CHANGE; TESTING ANALYSIS; TRANSMISSION ELECTRON; VOLTAGE CONTRAST;

DEFECTS;

EID: 0012374301     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1997p0115     Document Type: Conference Paper

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