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Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3333, Issue , 1998, Pages 909-915

Etch integration issues in the development of deep submicron contacts utilizing DUV resist and organic BARC

(5) Ramanathan, Viswanathan a Chen, Shixiong a Lai, Kafai a Brongo, Maureen R a Samarakone, Nandasiri a

a Rockwell Semiconductor Systems (United States)

Author keywords

Contacts; DUV resist; Etch resistance; Fluorocarbon etchants

Indexed keywords

ANTIREFLECTION COATINGS; JITTER; TABLE LOOKUP; THICKNESS MEASUREMENT;

CONTACT LEVELS; CONTACTS; CRITICAL DIMENSION VARIATIONS; DEEP SUB-MICRON PROCESS; DEEP SUBMICRON; DEEP-UV LITHOGRAPHIES; DEPTH OF FOCUS; DUV RESIST; ETCH CHEMISTRIES; ETCH RATES; ETCH RESISTANCE; ETCH TOOLS; EXPOSURE LATITUDES; ORGANIC BARC; PLASMA ETCH; PROCESS TECHNOLOGIES; REACTIVE IONS; RESIST FORMULATIONS; RESIST PROFILES; RESIST SYSTEMS; WAFER TEMPERATURES;

PHOTORESISTS;

EID: 0012024862 PISSN: 0277786X EISSN: None Source Type: Conference Proceeding
DOI: 10.1117/12.312473 Document Type: Conference Paper

Times cited : (2)

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