A peec with a new capacitance model for circuit simulation of interconnects and packaging structures

IEEE Transactions on Microwave Theory and Techniques

Volumn 48, Issue 2, 2000, Pages 281-287

  Cao, Yi ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Integrated circuit; Interconnect and packaging; Lorentz gauge; PEEC; State equations

Indexed keywords

EID: 0011857441     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.821777     Document Type: Article

References (14)

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