Semiconductor and thin film applications of a quadrupole mass spectrometer

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 4, 1999, Pages 1469-1478

  Waits, Robert K ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0006770497     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581838     Document Type: Article

References (39)

1. Y. Sosniak, Transactions of the 12th AVS Vacuum Symposium (Macmillan, New York, 1965); G. Stern and H. L. Caswell, J. Vac. Sci. Technol. 10, 284 (1967).
2. Y. Sosniak, Transactions of the 12th AVS Vacuum Symposium (Macmillan, New York, 1965); G. Stern and H. L. Caswell, J. Vac. Sci. Technol. 10, 284 (1967).
3. See, for example, L. Noble and R. K. Waits, 1961 Transactions of the 8th AVS Vacuum Symposium (Pergamon, London, 1962), p. 2606.
4. M. J. Drinkwine and D. Lichtman, American Vacuum Society Monograph, 1979, pp. 106-107.
5. Phys. Today, 51(8), Pt. 2, 1998 Buyers Guide, p. BG179.
6. D. Lichtman, J. Vac. Sci. Technol. A 8, 2810 (1990).
7. H. W. Werner and A. J. Linssen, J. Vac. Sci. Technol. 11, 843 (1974).
8. J. F. O'Hanlon, A User's Guide to Vacuum Technology, 2nd ed. (Wiley Interscience, New York, 1989), Chap. 8.
9. K. C. Lin and F. P. Pickett, U.S. Patent No. 4,689,574 (filed 14 November 1985).
10. J. E. Blessing, Research Devel. 29(10), 81 (1978).
11. N. Müller, G. Rettinghaus, and G. Strasser, J. Vac. Sci. Technol. A 8, 2822 (1990).
12. G. B. Bunyard, Vacuum 24, 633 (1993).
13. R. J. Ferran and S. Boumsellek, J. Vac. Sci. Technol. A 14, 1258 (1996).
14. D. H. Holkeboer, T. L. Karandy, F. C. Currier, L. C. Frees, and R. E. Ellefson, J. Vac. Sci. Technol. A 16, 1157 (1998).
15. D. E. Meyer, Electron. Packaging Product. 13(8) (1973).
16. R. W. Springer and D. S. Catlett, J. Vac. Sci. Technol. 15, 210 (1978).
17. M. J. Verkerk and G. J. van der Kolk, J. Vac. Sci. Technol. A 4, 3102 (1986).
18. D. E. Meyer, J. Vac. Sci. Technol. 11, 168 (1974).
19. M. J. Rocke, J. Vac. Sci. Technol. A 6, 1675 (1988).
20. D. R. Frear, A. N. Campbell, B. L. Draper, and R. E. Mikawa, J. Electron. Mater. 18, 517 (1989).
21. C. D. Bennewitz, W. D. Westwood, and J. D. Brown, J. Appl. Phys. 46, 558 (1973).
22. J. C. Blair and P. B. Ghate, J. Vac. Sci. Technol. 14, 79 (1977).
23. B. A. Raby, J. Vac. Sci. Technol. 15, 205 (1978).
24. T. C. Smith, in Ion Implantation: Equipment and Techniques, edited by H. Ryssel and H. Glawischnig (Springer, New York, 1983), p. 196.
25. A. Renau, M. E. Mack, J. P. O'Connor, and N. Tokoro, Nucl. Instrum. Methods Phys. Res. B 55, 61 (1991).
26. G. G. Barna, M. M. Moslehi, and Y. J. Lee, Solid State Technol. 37(4), 57 (1994).
27. J. J. Cummings and D. T. Enloe, Nucl. Instrum. Methods Phys. Res. B 55, 55 (1991).
28. R. K. Waits, Semicond. Int. 16(10), 84 (1993).
29. R. K. Waits, MICRO 15(6), 81 (1997).
30. S. Kobayashi, E. Nishitani, H. Shimamura, A. Yajima, S. Kishimoto, Y. Yoneoka, H. Uchida, and N. Morioka, Proc. SPIE 2367, 80 (1995).
31. M. J. Goeckner, J. A. Meyer, G.-H. Kim, J.-S. Jenq, A. Mathews, J. W. Taylor, and R. A. Breun, J. Vac. Sci. Technol. A 11, 2543 (1993).
32. W. D. Westwood, J. Vac. Sci. Technol. 11, 175 (1974).
33. R. Shadmehr, D. Angell, P. B. Chou, G. S. Oehrlein, and R. S. Jaffe, J. Electrochem. Soc. 139, 907 (1992).
34. S. Thomas III, K. K. Ko, and S. W. Pang, J. Vac. Sci. Technol. A 13, 894 (1995).
35. F. A. Stevie, R. G. Wilson, D. S. Simons, M. I. Current, and P. C. Zalm, J. Vac. Sci. Technol. B 12, 2263 (1994).
36. R. G. Ridgeway, P. J. Maroulis, and R. V. Pearce, MICRO 15(1), 45 (1997).
37. G. A. Moore, Crossing the Chasm (Harper Business, New York, 1991).
38. P. A. Redhead, J. Vac. Sci. Technol. A 10, 2665 (1992).
39. C. Sun, W. N. Carr, and K. R. Farmer, poster paper presented at the 43rd AVS Symposium, October 1996 (unpublished).